SK Hynix announces $13B South Korea plant for HBM chip packaging targeting AI data centers, with construction starting April ...

Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

With TSMC’s CoPoS pilot line set for completion by mid-year, the semiconductor industry broadly expects volume production to ...

Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom ...

Intel’s EMIB packaging gains AI customer interest as demand rises and TSMC CoWoS supply constraints push companies toward alternatives.

Intel (INTC) has been derided for squandering its leadership position in the chip race while also not leveraging its ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is ...