Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...
With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...
TT Electronics, a global provider of engineered electronics for performance critical applications, has launched the QSOP-C and SOIC-C high-density resistor networks that combine high precision with ...
Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...
Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...
EL SEGUNDO, Calif.--(BUSINESS WIRE)--Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride (eGaN ®) power FETs and ICs, expands the selection of low voltage, ...
Power system designers are constantly under pressure to attain larger power densities and improved conversion efficiencies, whether it is for data servers for the internet of things or data centers.
Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, ...
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