As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these ...

A recent trend confusing two quite different terms has had a huge negative impact on the yield, reliability, and manufacturability of DSM (deep-submicron) and subwavelength semiconductor designs. This ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Obtaining reliable data from electric utilities about magnitude and duration of single-phase, line-to-ground fault currents at the service entrance of commercial and industrial facilities is of ...