ASML provided Intel, its first customer, with the $380 million Twinscan EXE:5000 High-NA lithography machine. Yesterday, it shipped its second High-NA EUV lithography machine to a mystery customer.

However, there have been hints Intel may insert high-NA earlier into its 18A node, which is ramping up today. There's a ...

TSMC has said that its new chip manufacturing technology -- A16 -- will enter production in the second half of 2026, where it will be in a semiconductor battle with Intel for the world's fastest chips ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has successfully achieved the fine pattern resolution required for photomasks for logic semiconductors of the beyond 2nm (nm: ...

Intel’s comeback in cutting edge manufacturing is no longer a vague roadmap, it now revolves around a single, spectacular machine: ASML’s latest High-Numerical Aperture Extreme Ultraviolet scanner. By ...

China has built a prototype EUV (extreme ultraviolent) lithography machine in a high-security laboratory in Shenzhen. They had a semiconductor Manhattan Project”. The prototype was completed in early ...

SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in advanced process ...

According to a report from Tom's Hardware, China's so-called "Frankenstein" EUV scanner was assembled from mismatched parts sourced through various channels, potentially including surplus equipment ...

Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec has more than 6.000 employees and top researchers, for R&D in advanced semiconductor and system ...

Belgium-based semiconductor research institute Imec will present its latest achievements that enable high-numerical aperture (High-NA) extreme ultraviolet (EUV) lithography at the 2024 Advanced ...

Glass masks contribute to EUV mask blanks market expansion by offering exceptional surface smoothness, dimensional stability, ...