Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...
Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...
VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...
ProMed, a contract manufacturer specializing in liquid silicone rubber (LSR) and highly regulated combination products, has announced new process refinements in the LSR injection molding process ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback