SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...

This is the first of several articles in the PCB Design Best Practices series, which discusses the different steps of PCB development from the basics of creating a design schematic with specific ...

T-Works is getting a multi-layer printed circuit board (PCB) fabrication facility that can facilitate rapid fabrication of up to 12-layer boards, thus helping accelerate electronic product prototyping ...

Driven by the explosion of big data and expanding applications, chip design complexity is increasing. Applications such as high-performance computing (HPC), the Internet of Things (IoT), automotive, ...

Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...