From newer sustainable materials to innovations in preserving shelf life and product quality, manufacturers are unveiling ...
Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...
The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...
The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...
Novel hybrid polymer “PET/F” expected to deliver enhanced performance compared with traditional PET plastic and have up to 100% bio content WEST SACRAMENTO, Calif. & BOLTON, Ontario--(BUSINESS ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
Four firms collaborate on foaming technology that incorporates recycled content while maintaining performance in multiple ...
Functional packaging materials are increasingly designed to actively protect drug products, integrating moisture and impurity ...
The funding will upgrade processing and packaging technology, boosting halal-certified output and improving food safety and ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
PureCycle Technologies, Churchill Container, and 4ocean team to turn a souvenir cup keepsake into a sustainable packaging ...