Morningstar

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. The study allows to identify and mitigate thermal ...
Hosted on MSN

Imec pushes 3D HBM-on-GPU technology to extreme limits

3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
Semiconductor Engineering

STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)

A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université ...
Nasdaq

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications / Key Highlights TSMC and Ansys advance AI-assisted workflows to support ...
KVOA 4

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures Imec ...
Missoulian

Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach

Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures ...