IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Editor’s note: The following white paper is from an IMAPS conference in 2014 in San Diego presented by GaN Systems and AT&S. We were just granted permission to publish this paper. Large GaN ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Our conventional type of GaN power transistor is encapsulated into high heat diffusion surface-mount package TO220 (size:15 x 9.9 x 4.6mm), however the package is not enough to be small and it is ...
For many recent generation power semiconductors, package innovation makes a significant contribution to key performance parameters. In the case of HV MOSFETs, high-speed hard-switching transitions are ...
TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO: 6502) today announced the launch of a new line-up of low input current type transistor output photocouplers that guarantee high CTR (Current ...
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