Business Wire

OmniVision Unveils World’s First Automotive Wafer-Level Camera Module, Enabling Better Driver Monitoring Systems in More Vehicles

SANTA CLARA, Calif.--(BUSINESS WIRE)--OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first ...
Optics

ficonTEC introduces industry’s first, ATE agnostic, top-sided electro-optical wafer-level tester

ficonTEC proudly announces the release of a new single-sided electro-optical wafer-level tester, a first-of-its-kind solution fully compatible with the world’s two largest semiconductor ATE (automated ...
Nasdaq

Aehr Announces Shipment of New High-Power Configured FOX-XP(TM) System for Wafer Level Burn-in and Stabilization of Next Generation Silicon Photonics Integrated Circuits

FREMONT, CA / ACCESSWIRE / March 1, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has shipped the first order from a ...
Seeking Alpha

FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...
Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...