TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the invisible brain behind every intelligent system. As ...

Samsung has reportedly hired a veteran semiconductor engineer who worked for its foundry arch-rival TSMC for almost two decades. Lin Jun-cheng will serve the Korean firm as the senior vice president ...

Newer technologies such as 3D chips and heterogeneous packaging is pushing the focus towards materials engineering, Prabu Raja, president, of the Semiconductor Products Group at Applied Materials told ...

Highlighting global industry requirements, Vaishnaw said that as the semiconductor industry grows from the current size of ...

Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) -- The "3D Semiconductor Packaging Market Report 2026" has been added to ResearchAndMarkets.com's offering. This report provides a thorough insight into the ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

Union Minister Ashwini Vaishnaw highlights India's progress towards its 10-year goal of training 85,000 semiconductor ...

Government of India's initiative for prioritizing talent development through Training, Up-skilling and Workforce Development ...