Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory ...
Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale” was published by researchers at Cornell ...
Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures ...
A new technical titled “Impact of Random Phase Distribution on Ferroelectric Tunnel Field-Effect Transistors With Mitigation Strategies for Compute-in-Memory Applications” was published by researchers ...
A new technical paper titled “A Case for Hypergraphs to Model and Map SNNs on Neuromorphic Hardware” was published by ...
A new technical paper titled “Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement ...
Efficient SLM Edge Inference via Outlier-Aware Quantization and Emergent Memories Co-Design” was published by researchers at ...
A new technical paper titled “Improving Contact Resistance in Top-Gate Carbon Nanotube Transistor through Self-Aligned MoOx ...
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...
How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.
Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
A new technical paper, “Secure Multi-Path Routing with All-or-Nothing Transform for Network-on-Chip Architectures,” was ...
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