China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end ...

Like a spark igniting a new circuitry of ambition, Odisha steps onto the map of tomorrow’s technology. A Historic Leap in ...

Modern artificial intelligence chips, such as those made by Nvidia, are not single chips but several chips glued together ...

Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

Odisha CM Mohan Charan Majhi and Union Minister Ashwini Vaishnaw launched India’s first advanced 3D glass chip packaging unit ...

Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global ...

TAIPEI (Taiwan News) — TSMC plans to operate an advanced chip packaging facility in Arizona by 2029, expanding its US ...

This AI infrastructure leader could prove to be an exceptional pick in the long run.

India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...

By Stephen Nellis and Max A. Cherney SANTA CLARA, California, April 22 (Reuters) - Taiwan Semiconductor Manufacturing Co on ...