Intel has started stuffing its Panther Lake silicon into passport-sized boards for edge AI and embedded kits. At Intel Tech Tour 2025 the outfit showed off its Panther Lake modules, and now congatec ...

However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...

TDK said the DC-DC converter is already used in Altera’s Agilex family of FPGAs and AMD’s programmable SoCs, including several of the AI-class processors in its Versal ...

Assessing the effect of climate extremes on maternal and infant health is hindered by gaps in exposure data, vulnerability assessments and integration of sociobehavioural dimensions.

The all-new Rogue reimagines helmet communication system combines full-featured performance with a bold design.