Nvidia snaps up capacity for a key part of AI chipmaking, and the U.S. buildout may not be enough to keep up

There's a new bottleneck in AI chipmaking that almost all happens in Asia right now: advanced packaging. It connects smaller ...

AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the ...

Intel is going all-in on advanced chip packaging

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...
Condé Nast Traveler

The Golden Rules of Packing

They say that the journey is more important than the destination—but I'd argue that packing for said journey is the most important part of all. I've been a travel editor for nearly a decade, bopping ...