Discover which academic programs are still accepting applications for admission to upcoming sessions. Please note that programs may close at any point after the official deadline without warning. If ...

Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...

The UAB Heersink SOM MSTP provides a truly integrated MD-PhD training program for aspiring physician scientists. During the first 2-years of the program, our students take both a selection of medical ...

Abstract: To address the issues of voids and insufficient interface fusion commonly encountered in electroless copper plating interconnections for high-density packaging, this paper proposes a ...