Abstract: In practical application of Ball Grid Array (BGA), temperature changes usually cause solder joint degradation, leading to the crack even final failure of BGA. Using external means to reduce ...
Abstract: Chip-package co-simulation is required to predict the interaction between the chip and package at the system level. The FDTD method can be used to analyze these structures but is limited by ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results