Abstract: This study developed a 3D Computational Fluid Dynamics (CFD) model to compute the thermal resistance of the SiC-based direct cooled ACEPACK™ DRIVE power module, by STMicroelectronics. The ...
Abstract: The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome ...
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