ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced a new branding and ...

Not only do these products fail to address the skew problem, they bring with them new problems. Their resin chemistries -- heavily filler-loaded to achieve CTE and DF requirements -- create a mismatch ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

The global race for critical minerals is speeding up, and the United States depends heavily on Canada for resources used in ...

Thin dry‑film solder mask systems deserve consideration in UHDI applications. Modern dry films can reliably image clearances on the order of 60µm and, in some cases, offer better dimensional stability ...

DALLAS, March 27, 2026--(BUSINESS WIRE)--Generational Group, a leading mergers and acquisitions advisory firm for privately held businesses, is pleased to announce the sale of Rapid Electroplating ...

Generational Group Advises Rapid Electroplating Process, Inc. in its Sale to B & B Electroplating Co., Inc. Generational Group, a leading mergers and acquisitions advisory firm for privately held ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

The chip market is facing a wave of price increases, with IDM companies issuing hike notices and foundries preparing to raise prices for the 8-inch wafer process amid current supply-demand dynamics.

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.

Intel (INTC), reportedly, has been in discussions with at least two large customers, including Amazon and Google, for its ...