ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase ...

ROHM Semiconductor today announced it has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the ...

Earlier this month, Microchip Technology released its BZPACK mSiC power modules, engineered to exceed stringent HV-H3TRB ...

New reference platforms streamline three-phase inverter development, reducing design complexity while accelerating adoption ...

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC ...

Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" explores the growing power module packaging materials market, driven by the rise of SiC and GaN semiconductors and electric vehicles.

The QSiC™ Gen3 SiC modules from SemiQ Inc are silicon carbide power modules designed for compact and efficient active front ...

Rohm has begun online sales of new SiC moulded modules: TRCDRIVE pack, HSDIP20 and DOT-247 from distributors such as DigiKey.

ROHM Semiconductor U.S.A., LLC announced its participation at APEC 2026, the premier event for the power electronics ...

Designs speed up design evaluation for inverter circuits featuring EcoSiC SiC modules Rohm has released reference designs ...

As a provider of advanced materials solutions for power device packaging, Indium Corporation will feature its lineup of high-reliability products at APEC 2026, March 22 to March 26, in San Antonio, ...

Revolutionary 10 kV SiC Technology Delivers Game-Changing Solution for Grid Modernization, Industrial Electrification and AI Data Center InfrastructureDURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc., a ...