Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
We just reported that the AMD Ryzen AI Embedded P100 series has been expanded with six additional SKUs, and, timed with that, SolidRun has announced ...
Abstract: Bond wire fatigue is a prominent problem in the reliability of IGBT modules and power electronic converter. The fatigue evaluation method of IGBT bond wire based on non-invasive methods has ...
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