Applied Materials Introduces Deposition Systems for Angstrom-Era Logic Chips

Chipmaking systems create the smallest atomic-scale features in 3D Gate-All-Around transistorsPrecision™ Selective Nitride PECVD preserves ...
EDN

Advancing AI performance with HBM4, SPHBM4 DRAM solutions

HBM has become one of the most successful and widely adopted examples of chiplet-based integration in AI systems.
Semiconductor Engineering

AI Accelerators Usher In New Era For IC Test

The number and variety of test interfaces, coupled with increased packaging complexity, are adding a slew of new challenges.
Frontiers

Overcoming thermal bottlenecks in energy conversion hardware with nano-engineered materials and interfaces

Thermal management in energy conversion hardware is an increasingly critical field in response to the worldwide drive for electrification and deployment of ...