NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI

First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components ...
Electronic Design

Embedded World 2026: Boards and Modules (Part 1)

Rugged boards and modules were everywhere at this year’s Embedded World 2026. New form factors like VITA 93 QMC were on ...
24/7 Wall St.

Skyworks vs. Qorvo: Two RF Chip Giants Fighting for the Same 5G Dollar

Skyworks Solutions (NASDAQ:SWKS) and Qorvo (NASDAQ:QRVO) just reported earnings as direct RF chip competitors, but here is ...
Directions Magazine

Telit Cinterion Expands Gnss Portfolio With New Dual-band Modules

Telit Cinterion, a provider of end-to-end IoT solutions, has broadened its lineup with two dual-band positioning modules: the ...
IEEE

A 3-D Heterogeneously Integrated Application of the RF-Module With Micro-Bump Filter and Embedded AiP at W-Band

Abstract: In this study, we present the design, fabrication, and measurements of a 3-D heterogeneous integrated RF-module at W-band. A 3-D transition structure based on micro-bumps is fabricated and ...
IEEE

Assessing the Antenna Performance (Radiated Power) and Electromagnetic Impact (SAR) on a User of a Wearable RF Communication Device, Involving Variously Structured Models

Abstract: The investigations focused on the significance of the structural design of models of a wearable device equipped with a wireless radiofrequency communication module (W-RFCD) operating at 2.45 ...