As HPC and AI accelerators push power densities to 1kW and beyond, the heat generated by rapidly switching transistors is ...

Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such as 2.5D and ...

For over 5 years, Arthur has been professionally covering video games, writing guides and walkthroughs. His passion for video games began at age 10 in 2010 when he first played Gothic, an immersive ...

Broadcom commenced shipments of an apparent industry first in the form of two-nanometer (nm) custom compute system on chip (SoC). Built on the chip giant’s 3.5D eXtreme Dimension System in Package ...

Plisinski stated, "we estimate advanced packaging revenue to grow over 30% in 2026, resulting in a new revenue record for this market." He also projected revenue for the first quarter to be in the ...

Epic Games Publishing and developer Spiral House will release PC Building Simulator 2 for PlayStation 5 and Xbox Series on February 26, the companies announced. PC Building Simulator 2 first launched ...

A new leak says that Apple’s M5 Pro and M5 Max chips might not be two distinct chips but variants of the same one. Apple is reportedly using new 2.5D chip tech, allowing it to use a single M5 Max chip ...

It’s previously been suggested that the upcoming M5 Pro and M5 Max MacBook Pro models will allow you to make a more flexible choice of CPU and GPU cores. A recent change to Apple’s website seems to ...