Punching is a possible failure mode for slender footings and it may lead a structure to ruin through progressive collapse. Although footing present different geometric characteristics, their punching ...

Abstract: Recently, the interconnection bandwidth of the data center is rapidly increasing. To satisfy the requirement for the high-performance data center, a 4-channel 2.5D silicon photonic ...

Reinforced concrete elements with a high longitudinal and transverse reinforcement ratio may present conflicts on both of them, resulting in reduced labor productivity and a poor job when assembling ...

Abstract: 2.5D packages have been widely used in electronics industry for high performance and product miniaturization. As Through-Silicon-Via (TSV) fabrication methods and multi-level assembly ...