Abstract: In multi-chip IGBT power modules, package-level failures typically manifest first as localized distortions in the copper baseplate temperature field before evolving into catastrophic faults.

Abstract: The evolution of wireless communications has been significantly influenced by remarkable advancements in multiple access (MA) technologies over the past five decades, shaping the landscape ...

Project Maven stands as one of the earliest and most consequential efforts to bring AI into military operations. This week, Elisa sits down with Lt. Gen. Jack Shanahan, former Director of the ...

An audience member seated near a Microsoft logo listens as Microsoft Chairman and Chief Executive Officer Satya Nadella speaks during the Microsoft Build conference opening keynote in Seattle, ...