IEEE

Integrated Package-to-System Thermal Solution Evolution for High-Performance 2.5D CoWoS-R Advanced Packaging Technology Development

Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
The Lancet

Development and validation of a screening tool for sepsis without laboratory results in the emergency department: a machine learning study

aEmergency Centre, Zhongnan Hospital of Wuhan University, Wuhan, Hubei, China bHubei Clinical Research Centre of Emergency and Resuscitation, Zhongnan Hospital of Wuhan University, Wuhan, Hubei, China ...
C&EN

Metal–Organic Frameworks in General Chemistry Laboratory: Toward the Development of Students’ Scientific Identities

Department of Chemistry, Oregon State University, Corvallis, Oregon 97331, United States ...