Supporting the Shift Toward Smarter and More Flexible SMT Production CALIFORNIA, CA, UNITED STATES, April 3, 2026 ...

Obsolescence management is often treated as a procurement function or pushed entirely onto the EMS partner. In reality, it is a shared responsibility between OEM leadership, engineering, supply chain, ...

In the solder paste process (SMT), the minimum safe distance between the SMD pads and the inline pads is recommended to be 0.4mm to 1mm. this distance effectively prevents solder paste bridging, ...

We at Circuitdigest have worked on a lot of PCB projects, but have consistently faced a challenge during the assembly process. Specifically, when working with SMD components, the use of solder paste ...

Abstract: In this paper, we present the application of the novel fluxfree soldering process for assembly of standard SMD components on a PCB. A standard SAC305 (Sn-3.0Ag-0.5Cu) type 3 powder is mixed ...

Today’s electronic manufacturing businesses, whether OEM or ODM/EMS, need to be able to handle component types from the smallest SMD chips to large semiconductors as well as unusual components like ...

When doing surface-mount assembly you can certainly use a soldering iron in the traditional way, but it’s far more convenient to cover the pads with solder paste, place the components, and bake the ...

A new way to assess up to 25 solder paste properties on an assembly line in five hours or less. Why change solder pastes? Because defects like solder balls, tombstones, skews, bridges and voids can ...